Author(s) :

Darshan H B, Mallikarjuna D M, Shivaningappa Teli, Suma M R, Vidyashree K N .

Volume/Issue :

Abstract :

The Surface Mount Technology (SMT) industry is a cornerstone of modern electronics manufacturing, offering high component density, improved performance, and reduced production costs. However, ensuring optimal workflow in SMT lines remains a complex challenge due to the interplay of process variables across multiple stages—printing, placement, reflow, and inspection. This paper presents a comprehensive SMT industry workflow framework, integrating proven defect minimization strategies from no-clean solder processes with contemporary best practices in smart manufacturing. By analysing key defects such as solder balling, tombstoning, bridging, and skewed components, the study outlines root causes and preventive techniques drawn from real-world production data and empirical research. Special attention is given to reflow profiling, environmental control, and material handling as critical control points. The proposed workflow emphasizes process standardization, inline quality control, and environmental optimization to achieve high first-pass yield and six sigma-level reliability. This research aims to guide engineers and manufacturers in evolving their SMT operations toward robust, scalable, and defect-resilient systems aligned with Industry 4.0 principles.

No. of Downloads :

0